Form

This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.

Application

This adhesive compound has been used typically for nonstructural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components operating at not higher than 185 °F (85 °C), but usage is not limited to such applications.

Safety - Hazardous Materials

While the materials, methods, applications, and processes described or referenced in this specification may involve the use of hazardous materials, this specification does not address the hazards which may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved.