Purpose

This specification covers the engineering requirements for preparing surfaces of polytetrafluoroethylene (PTFE) for bonding and the properties resulting from the treatment.

Application

This process has been used typically for rendering surfaces of parts capable of supporting a high strength adhesive bond. The bonding preparation can affect the electrical properties of the PTFE and this should be considered before using it for treatment of electronic components.

Safety - Hazardous Materials

While the materials, methods, applications, and processes described or referenced in this specification may involve the use of hazardous materials, this specification does not address the hazards which may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved.