Form

This specification covers the requirements for electrodeposited copper.

Application

This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces on which carburizing is neither required or permitted, to prevent decarburization, to enhance solderability, or to provide a source of copper for furnace brazing, but usage is not limited to such applications.

Classification

Plating covered by this specification is classified as follows:

Type 1 - Engineering plating

Type 2 - Plating for masking

Type 1 shall be supplied if no class is specified.